surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 2 1.feature 100 watts peak power per line(tp=8/20us) sot553 package protects three bidirectional lines and four unidir ectional lines monolithic structure working woltage: 5v low clamping voltage esd protection > 40kv low leakage current rohs compliant transient protection for data lines to iec 610004 2(esd) 15kv (air), 8kv (contact); iec 6100044 (eft) 40a (5/50ns) 2. application communication systems printers notebooks and hand hold computers pdas video equipment 3. electrical characteristics per line@25 (unless otherwise specified) note 1 parameter symbol conditions min. typ. max. units reverse standoff voltage v rwm 5 v reverse breakdown voltage v br i t =1ma 6 v reverse leakage current i r v rwm =5v t =25 5 ua clamping voltage v c i pp =1a t p =8/20us 8.8 v clamping voltage v c i pp =10a t p =8/20us 10.0 v junction capacitance c j v r =0v f=1mhz 40 pf note 1: pin 1,3,4,5 to pin 2
surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 3 4. absolute maximum rating @25 note 1 rating symbol value units peak pulse power(t p =8/20s) p pp 100 w forward voltage@1 0ma v f 1.5 v operating temperature t j 55 to +150 storage temperature t stg 55 to +150 note 1: pin 1,3,4,5 to pin 2 5.typical characteristics
surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 4
surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 5 6. product dimension and pad size. package dimension dim milimeter inches min max min max a 1.50 1.70 0.059 0.067 b 1.1 1.3 0.043 0.051 c 0.50 0.60 0.020 0.024 d 0.17 0.27 0.007 0.011 g 0.50 bsc 0.020 bsc j 0.06 0.16 0.003 0.006 k 0.10 0.30 0.004 0.012 s 1.50 1.70 0.059 0.067 mounting pad typical dim milimeter inches 1 0.30 0.012 2 1.02 0.040 3 0.51 0.020 4 1.40 0.055 5 0.51 0.020 notes: 1. controlling dimension inches 2. pin 3 is the cathode (unidirectional only). 3. dimensions are exclusive of mold lash and metal burrs
surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 6 7.packing information 8. application note the ses5vt5535 is tvs arrays designed to protect i/o o r data lines from the damaging effects of esd or ef t. this product provides both unidirectional and bidir ectional protection, with a surage capability of 10 0 watts ppp line for an 8/20s wave shape and esd protection > 25kv. commonmode unidirectional configuration(figure 1) the ses5vt5535 provides up to 4 lines of protectio n in a commonmode unidirectional configuration as depicted in figure 1. circuit connectivity is as follows: line 1 is connected to pin1. line 2 is connected to pin3. line 3 is connected to pin4. line 4 is connected to pin5. pin2 is connected to ground. reel dia tape width ao bo ko d e f w po p2 p imax 178mm(7) 8mm 1.780.05 1.780.05 0.690.05 1.500.10 1.750.10 3 .500.10 8.000.30 4.000.10 2.000.005 4.000.10 0 .25
surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 7 commonmode unidirectional configuration(figure 2) the ses5vt5535 provides up to 3 lines of protectio n in a commonmode bidirectional configuration as depicted in figure 2. circuit connectivity is as follows: line 1 is connected to pin1. line 2 is connected to pin3. line 3 is connected to pin4. pin5 is connected to ground. pin2 is not connected. differentialmode bidirectional configuration (figu re 3) the ses5vt5535 provides up to 4 lines of protectio n in a differentialmode bidirectional configuratio n as depicted in figure 3. circuit connectivity is as follows: line 1 is connected to pin1. line 2 is connected to pin3. line 3 is connected to pin4. line 4 is connected to pin5. pin2 is not connected.
surge components, inc 95 east jefryn blvd deer park, ny 11729 (631)5951818 8 circuit board layout and protection device placemen t: circuit board layout is critical for suppression of esd transients. the following guidelines are recommended: 1. place the protection devices as close to the inp ut terminal or connector as possible. 2. the path length between the protection device an d protected line should be minimized. 3. keep parallel signal pats to a minimum. 4. avoid running protection conductors in parallel with unprotected conductor. 5. minimize all printedcircuit board conductive lo ops including power and ground loops. 6. minimize the length of the transient return path to ground. 7. avoid using shared transient return paths to com mon ground point. 8. ground planes should be used whenever possible. for multilayer printedcircuit boards, use ground v ias.
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